BE Semiconductor (BSIA) Stock Price & Analysis
BSIA Stock Chart & Stats
- Day’s Range
- EUR 154.00 - EUR 154.00
- 52-Week Range
- EUR 121.00 - EUR 336.00
- Previous Close
- EUR 155.00
- Volume
- N/A
- Average Volume (3M)
- 11
- Market Cap
- EUR 12.43B
- Enterprise Value
- EUR 17.36B
- Total Cash (Recent Filing)
- EUR 601.90M
- Total Debt (Recent Filing)
- EUR 361.34M
- Price to Earnings (P/E)
- 42.4
- Beta
- 1.05
- Next Earnings
- Feb 25, 2027 (Est.)
- EPS Estimate
- 1.32
- Next Dividend Ex-Date
- N/A
- Dividend Yield
- 1.05%
Bulls Say, Bears Say
Bulls Say
Growth And Order Momentum
Rapid revenue and order growth indicates strengthening demand for Besi’s equipment across computing and other end markets. The order expansion improves forward visibility, supports operating leverage, and provides a durable foundation for continued growth as semiconductor capacity investment progresses.
Advanced Packaging Leadership
Growing hybrid bonding adoption and a broadening customer base strengthen Besi’s position in advanced packaging, an important technology transition. Design wins and deployed systems can reinforce customer relationships, expand service opportunities, and support market share over multiple years.
Cash Generation And Profitability
Strong conversion of earnings into operating and free cash flow demonstrates financial quality and gives Besi capacity to fund research, support customers, and return capital. Healthy cash generation also improves resilience when semiconductor investment cycles become less favorable.
Bears Say
Cyclical Revenue Profile
Besi’s dependence on semiconductor capital spending leaves revenue and earnings exposed to periodic industry downturns. Even with a strong rebound, prior contractions show that demand can reverse, creating variability in utilization, profitability, cash generation, and capital-return capacity.
Hybrid Bonding Adoption Timing
The long-term hybrid bonding opportunity is substantial, but customer-controlled production schedules create uncertainty around conversion from development activity to volume shipments. Delayed adoption could defer expected growth, leave existing technologies in place longer, and increase quarterly execution variability.
Leverage Volatility
Although current leverage appears manageable, the historical swings indicate that Besi’s capital structure can change materially with business conditions or capital allocation. Higher leverage during a downturn could reduce financial flexibility, increase risk tolerance requirements, and constrain investment or shareholder returns.
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BE Semiconductor Stock Smart Score
Company Description
BE Semiconductor
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Richard W. Blickman
- Employees
- 1,856
- Website
- www.besi.com
- Address
- Ratio 6, Duiven, GE, 6921 RW, NL
BE Semiconductor (BSIA) Earnings & Revenues
BSIA Company Deck
BSIA Earnings Call
Earnings Call SentimentPositive
The call was strongly positive, with substantial revenue, order, earnings, margin, liquidity, market share, and hybrid bonding momentum. Management also described continued demand across AI, data center, photonics, memory, logic, and traditional markets, alongside ongoing investment and strategic collaboration. The main negatives were a flat fourth-quarter revenue outlook, higher fourth-quarter operating expenses due primarily to strategic consulting cost, variability in gross margins, and uncertainty around the timing of mainstream HBM hybrid bonding adoption.
View all DE:BSIA earnings summariesTechnical Analysis
Overall Consensus
| Indicator | Bullish | Neutral | Bearish |
|---|---|---|---|
| Overall Consensus | 2 | 5 | 15 |
| Technical Analysis | 2 | 5 | 3 |
| Moving Averages | 0 | 0 | 12 |
