BSIA Stock Chart & Stats
€189.00
-€19.00(-9.22%)
At close: 4:00 PM EDT
€189.00
-€19.00(-9.22%)
Day’s Range― - ―
52-Week Range€112.00 - €336.00
Previous CloseN/A
Volume20.00
Average Volume (3M)13.00
Market Cap
€14.20B
Enterprise Value€26.39K
Total Cash (Recent Filing)€349.09M
Total Debt (Recent Filing)€358.01M
Price to Earnings (P/E)67.3
Beta0.97
Next Earnings
Oct 22, 2026EPS Estimate
1.21Next Dividend Ex-DateN/A
Dividend YieldN/A
Share Statistics
EPS (TTM)2.64
Shares Outstanding81,146,736
10 Day Avg. Volume6
30 Day Avg. Volume13
Financial Highlights & Ratios
PEG Ratio-2.71
Price to Book (P/B)25.36
Price to Sales (P/S)18.59
P/FCF Ratio67.70
Enterprise Value/Market CapN/A
Enterprise Value/RevenueN/A
Enterprise Value/Gross ProfitN/A
Enterprise Value/EbitdaN/A
Forecast
1Y Price TargetN/A
Price Target UpsideN/A
Rating ConsensusN/A
Number of Analyst Covering0
EPS Forecast (FY)4.39
Revenue Forecast (FY)€1.00B
Bulls Say, Bears Say
Bulls Say
AI-driven DemandRising AI exposure connects Besi to a structural expansion in data-center and advanced semiconductor infrastructure spending. A growing share of AI-related orders can support sustained demand for assembly and packaging equipment beyond a single product cycle.
Advanced Packaging AdoptionThe increase in hybrid bonding customers indicates broader adoption of Besi’s advanced packaging technologies across logic, photonics, co-packaged optics and consumer applications. Wider qualification and use can deepen its technology position and expand future equipment opportunities.
Strong Cash GenerationNear-parity between free cash flow and net income indicates strong earnings quality and the ability to convert reported profits into usable cash. This supports investment in development, customer support and technology while preserving financial flexibility through industry cycles.
Bears Say
Cyclical Overcapacity RiskBesi’s equipment demand depends on customers’ semiconductor capital spending, so rapid capacity expansion could eventually create overcapacity and delay new orders. A normalization in demand would make revenue and earnings more volatile despite current order strength.
Hybrid Bonding Execution HurdlesLong qualification timelines and unresolved yield or cost issues could delay volume adoption of hybrid bonding, limiting how quickly current customer interest becomes recurring equipment revenue. Timing uncertainty is particularly relevant to memory applications and future growth expectations.
Margin And Spending PressureLess favorable product mix and higher development spending may reduce operating leverage even as revenue grows. If these pressures persist during technology transitions, they could temper margin expansion and make profitability more dependent on favorable equipment mix and execution.
BE Semiconductor News
BSIA FAQ
What was BE Semiconductor’s price range in the past 12 months?
BE Semiconductor lowest stock price was €112.00 and its highest was €336.00 in the past 12 months.
What is BE Semiconductor’s market cap?
BE Semiconductor’s market cap is €14.20B.
When is BE Semiconductor’s upcoming earnings report date?
BE Semiconductor’s upcoming earnings report date is Oct 22, 2026 which is in 35 days.
How were BE Semiconductor’s earnings last quarter?
BE Semiconductor released its earnings results on Jul 23, 2026. The company reported €1.094 earnings per share for the quarter, missing the consensus estimate of €1.103 by -€0.009.
Is BE Semiconductor overvalued?
According to Wall Street analysts BE Semiconductor’s price is currently Overvalued.
Does BE Semiconductor pay dividends?
BE Semiconductor does not currently pay dividends.
What is BE Semiconductor’s EPS estimate?
BE Semiconductor’s EPS estimate is 1.21.
How many shares outstanding does BE Semiconductor have?
BE Semiconductor has 81,146,736 shares outstanding.
What happened to BE Semiconductor’s price movement after its last earnings report?
BE Semiconductor reported an EPS of €1.094 in its last earnings report, missing expectations of €1.103. Following the earnings report the stock price went up 0.847%.
Which hedge fund is a major shareholder of BE Semiconductor?
Currently, no hedge funds are holding shares in DE:BSIA
What is the TipRanks Smart Score and how is it calculated?
Smart Score combines eight research factors - such as analyst recommendations, hedge fund trends, and technical indicators - to measure a stock’s outlook. These signals are unified into a single score that reflects bullish or bearish momentum. See detailed methodology
BE Semiconductor Stock Smart Score
Outperform
1
2
3
4
5
6
7
8
9
10
Technicals
SMA
Negative
20 days / 200 days
Momentum
47.33%
12-Months-Change
Fundamentals
Return on Equity
0.94%
Trailing 12-Months
Asset Growth
6.12%
Trailing 12-Months
Learn more about TipRanks Smart Score
Company Description
BE Semiconductor
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
BSIA Company Deck
BSIA Earnings Call
Q2 2026
0:00 / 0:00
Earnings Call Sentiment|Positive
The call presented a strongly positive operational and financial performance: robust revenue and orders growth, record backlog, materially higher profitability and improved net cash, driven largely by AI-related demand and expanding hybrid bonding and wafer-level opportunities. Principal risks highlighted included qualification/yield & cost challenges for hybrid bonding (timing uncertainty for memory HBM adoption), potential cyclical overcapacity as capacity expands, and some near-term margin mix pressure and higher development spend. On balance, highlights (large percentage gains, record orders/backlog, margin expansion, and confident near-term guidance) outweigh the lowlights, though the company cautioned about typical industry cyclicality and qualification timelines for new technologies.View all DE:BSIA earnings summaries