BSIA Stock Chart & Stats
€206.00
-€19.00(-9.22%)
At close: 4:00 PM EDT
€206.00
-€19.00(-9.22%)
Day’s Range― - ―
52-Week Range€102.00 - €336.00
Previous CloseN/A
Volume20.00
Average Volume (3M)10.00
Market Cap
€15.30B
Enterprise Value€26.39K
Total Cash (Recent Filing)€349.09M
Total Debt (Recent Filing)€358.01M
Price to Earnings (P/E)75.5
Beta1.03
Next Earnings
Oct 22, 2026EPS Estimate
1.18Next Dividend Ex-DateN/A
Dividend YieldN/A
Share Statistics
EPS (TTM)2.64
Shares Outstanding81,146,736
10 Day Avg. Volume16
30 Day Avg. Volume10
Financial Highlights & Ratios
PEG Ratio-2.71
Price to Book (P/B)25.36
Price to Sales (P/S)18.59
P/FCF Ratio67.70
Enterprise Value/Market CapN/A
Enterprise Value/RevenueN/A
Enterprise Value/Gross ProfitN/A
Enterprise Value/EbitdaN/A
Forecast
1Y Price TargetN/A
Price Target UpsideN/A
Rating ConsensusN/A
Number of Analyst Covering0
EPS Forecast (FY)4.39
Revenue Forecast (FY)€993.23M
Bulls Say, Bears Say
Bulls Say
Record Orders & BacklogA record 12-month order backlog provides multi-quarter revenue visibility and smoothing of cyclicality. High backlog supports predictable tool production, capacity planning, and recurring service/parts demand, improving revenue stability and investment planning over the coming quarters.
Strong Margins And Cash ConversionVery high gross and net margins combined with near-1.0 free cash flow conversion indicate durable earnings quality. Strong cash generation funds R&D, service expansion, dividends or debt reduction, and cushions earnings through semiconductor cycle downturns.
Hybrid Bonding Adoption And AI ExposureGrowing hybrid-bonding customer base and rising AI-related order mix point to structural demand for advanced packaging. This expands Besi's addressable market across datacenter, photonics and logic, supporting multi-year secular growth beyond short-term capex swings.
Bears Say
Hybrid Bonding Qualification RiskLengthy qualification, yield and cost hurdles can materially delay volume ramps and extend payback on R&D and equipment investments. That timing uncertainty may postpone service and consumables revenue, pressuring returns until customers clear yields at scale.
Cyclical Overcapacity RiskThe capital-equipment cycle and potential overcapacity can quickly depress tool orders and utilization. If AI or packaging capacity growth outpaces end-market demand, pricing and margins could face sustained pressure across the industry's multi-quarter adjustment cycles.
Volatile Leverage HistoryAlthough leverage improved recently, historically volatile debt levels show financial flexibility can swing with the cycle. Re-levering in downturns would amplify earnings variability and constrain the firm's ability to sustain R&D, service expansion, or shareholder returns during stress.
BE Semiconductor News
BSIA FAQ
What was BE Semiconductor’s price range in the past 12 months?
BE Semiconductor lowest stock price was €102.00 and its highest was €336.00 in the past 12 months.
What is BE Semiconductor’s market cap?
BE Semiconductor’s market cap is €15.30B.
When is BE Semiconductor’s upcoming earnings report date?
BE Semiconductor’s upcoming earnings report date is Oct 22, 2026 which is in 83 days.
How were BE Semiconductor’s earnings last quarter?
BE Semiconductor released its earnings results on Jul 23, 2026. The company reported €1.11 earnings per share for the quarter, missing the consensus estimate of €1.118 by -€0.009.
Is BE Semiconductor overvalued?
According to Wall Street analysts BE Semiconductor’s price is currently Overvalued.
Does BE Semiconductor pay dividends?
BE Semiconductor does not currently pay dividends.
What is BE Semiconductor’s EPS estimate?
BE Semiconductor’s EPS estimate is 1.18.
How many shares outstanding does BE Semiconductor have?
BE Semiconductor has 81,146,736 shares outstanding.
What happened to BE Semiconductor’s price movement after its last earnings report?
BE Semiconductor reported an EPS of €1.11 in its last earnings report, missing expectations of €1.118. Following the earnings report the stock price went up 0.847%.
Which hedge fund is a major shareholder of BE Semiconductor?
Currently, no hedge funds are holding shares in DE:BSIA
What is the TipRanks Smart Score and how is it calculated?
Smart Score combines eight research factors - such as analyst recommendations, hedge fund trends, and technical indicators - to measure a stock’s outlook. These signals are unified into a single score that reflects bullish or bearish momentum. See detailed methodology
BE Semiconductor Stock Smart Score
Outperform
1
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Blogger Sentiment
Bullish
DE:BSIA Sentiment 100%
Sector Average ―
Sector Average ―
News Sentiment
Very Bullish
Bullish news 100%
Bearish news 0%
Bearish news 0%
Technicals
SMA
Positive
20 days / 200 days
Momentum
70.72%
12-Months-Change
Fundamentals
Return on Equity
0.87%
Trailing 12-Months
Asset Growth
6.12%
Trailing 12-Months
Company Description
BE Semiconductor
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
BSIA Company Deck
BSIA Earnings Call
Q2 2026
0:00 / 0:00
Earnings Call Sentiment|Positive
The call presented a strongly positive operational and financial performance: robust revenue and orders growth, record backlog, materially higher profitability and improved net cash, driven largely by AI-related demand and expanding hybrid bonding and wafer-level opportunities. Principal risks highlighted included qualification/yield & cost challenges for hybrid bonding (timing uncertainty for memory HBM adoption), potential cyclical overcapacity as capacity expands, and some near-term margin mix pressure and higher development spend. On balance, highlights (large percentage gains, record orders/backlog, margin expansion, and confident near-term guidance) outweigh the lowlights, though the company cautioned about typical industry cyclicality and qualification timelines for new technologies.View all DE:BSIA earnings summariesTechnical Analysis
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