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BE Semiconductor (BESIY)
OTHER OTC:BESIY
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BE Semiconductor (BESIY) Price & Analysis

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BESIY Stock Chart & Stats

$227.10
-$20.09(-7.84%)
At close: 4:00 PM EDT
$227.10
-$20.09(-7.84%)

Bulls Say, Bears Say

Bulls Say
Strong Order MomentumRecord orders and backlog provide meaningful forward visibility for equipment revenue and indicate strong customer demand. The sharp increase also supports utilization of Besi’s platform, creates operating leverage, and strengthens its position through the current semiconductor investment cycle.
AI And Advanced Packaging ExposureGrowing AI exposure and adoption of hybrid bonding connect Besi to structural demand for higher-performance semiconductor packaging. Expanding customer participation across emerging packaging applications can broaden the installed base and support longer-term technology-led growth.
Strong Cash GenerationNear-complete conversion of earnings into free cash flow indicates strong earnings quality and gives Besi flexibility to fund research, support customers, and return capital. This cash generation provides resilience during investment cycles and reduces reliance on external financing.
Bears Say
Cyclical Overcapacity RiskBesi’s customers are increasing packaging capacity, but broad industry expansion could eventually exceed semiconductor demand. If utilization falls, manufacturers and OSATs may defer equipment purchases, making order growth and earnings vulnerable to a cyclical downturn.
Hybrid Bonding Adoption HurdlesHybrid bonding is strategically important, yet lengthy qualification timelines and unresolved yield and cost issues can delay commercial volume adoption. Slower customer ramps would postpone the revenue contribution from this technology and require continued development investment.
Margin Mix PressureA less favorable product mix can reduce profitability even while revenue grows, limiting the benefit of strong equipment demand. The pressure is compounded by planned development and support spending, which may moderate operating leverage as Besi invests to sustain future growth.

BE Semiconductor News

BESIY FAQ

What was BE Semiconductor’s price range in the past 12 months?
BE Semiconductor lowest stock price was $127.58 and its highest was $366.91 in the past 12 months.
    What is BE Semiconductor’s market cap?
    BE Semiconductor’s market cap is $18.47B.
      When is BE Semiconductor’s upcoming earnings report date?
      BE Semiconductor’s upcoming earnings report date is Oct 22, 2026 which is in 43 days.
        How were BE Semiconductor’s earnings last quarter?
        BE Semiconductor released its earnings results on Jul 23, 2026. The company reported $1.262 earnings per share for the quarter, missing the consensus estimate of $1.272 by -$0.01.
          Is BE Semiconductor overvalued?
          According to Wall Street analysts BE Semiconductor’s price is currently Overvalued. Get more investment ideas with TipRanks Premium
            Does BE Semiconductor pay dividends?
            BE Semiconductor pays a Annually dividend of $1.848 which represents an annual dividend yield of 0.8%. See more information on BE Semiconductor dividends here
              What is BE Semiconductor’s EPS estimate?
              BE Semiconductor’s EPS estimate is 1.4.
                How many shares outstanding does BE Semiconductor have?
                BE Semiconductor has 81,146,736 shares outstanding.
                  What happened to BE Semiconductor’s price movement after its last earnings report?
                  BE Semiconductor reported an EPS of $1.262 in its last earnings report, missing expectations of $1.272. Following the earnings report the stock price went down -7.653%.
                    Which hedge fund is a major shareholder of BE Semiconductor?
                    Currently, no hedge funds are holding shares in BESIY
                    What is the TipRanks Smart Score and how is it calculated?
                    Smart Score combines eight research factors - such as analyst recommendations, hedge fund trends, and technical indicators - to measure a stock’s outlook. These signals are unified into a single score that reflects bullish or bearish momentum. See detailed methodology

                      BE Semiconductor Stock Smart Score

                      Company Description

                      BE Semiconductor

                      BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.

                      BE Semiconductor (BESIY) Earnings & Revenues

                      BESIY Company Deck

                      BESIY Earnings Call

                      Q2 2026
                      0:00 / 0:00
                      Earnings Call Sentiment|Positive
                      The call presented a strongly positive operational and financial performance: robust revenue and orders growth, record backlog, materially higher profitability and improved net cash, driven largely by AI-related demand and expanding hybrid bonding and wafer-level opportunities. Principal risks highlighted included qualification/yield & cost challenges for hybrid bonding (timing uncertainty for memory HBM adoption), potential cyclical overcapacity as capacity expands, and some near-term margin mix pressure and higher development spend. On balance, highlights (large percentage gains, record orders/backlog, margin expansion, and confident near-term guidance) outweigh the lowlights, though the company cautioned about typical industry cyclicality and qualification timelines for new technologies.View all BESIY earnings summaries
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                      Ownership Overview

                      <0.01%99.98%
                      Insiders
                      <0.01% Other Institutional Investors
                      99.98% Public Companies and
                      Individual Investors
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