Education
About Us
Working with TipRanks
Follow Us
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (HK:2291)
:2291
Dividend Data
Last Ex-Dividend Date
May 26, 2025Payment date
―
―
Dividend Amount Per Share
HK$0.674Annually
Dividend Yield
3.63%Sector: Healthcare
Sector Average: 1.657%
Sector Average: 1.657%
Payout Ratio
74.65%Dividend Growth
a year agoSince 2024
Last 3 Months
2291 Dividend History
Ex-Date | Record Date | Payment Date | Frequency | Declaration Date | Amount |
|---|---|---|---|---|---|
May 26, 2025 | ― | ― | Annually | ― | HK$0.67 |
May 28, 2024 | ― | ― | Annually | ― | HK$0.63 |
FAQ
How much is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's dividend?
HK:2291 pays a dividend of HK$0.674 per share. HK:2291's annual dividend yield is 3.63%.
When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H ex-dividend date?
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (HK:2291) does not pay a dividend.
When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H dividend payment date?
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (HK:2291) does not pay a dividend.
Does LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H have sufficient earnings to cover their dividend?
Yes, HK:2291's past year earnings per share was HK$0.57, and their annual dividend per share is HK$0.67. HK:2291's dividend payout ratio is 74.65% (HK$0.67/HK$0.57) which is sustainable.