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LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (HK:2291)
:2291
Hong Kong Market
2291
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H
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LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (2291) Dividend Date & History

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LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (2291) pays a Annual dividend. This page shows 2291’s dividend history, latest dividend amount, dividend yield, ex-dividend date, record date, and dividend payment date.

Dividend Data

Dividend Data
Last Ex-Dividend Date
May 27, 2026
Payment date​
Jul 31, 2026
Dividend Amount Per Share
HK$0.573
Annually
Dividend Yield
4.22%
Sector: Healthcare
Sector Average: 1.423%
Payout Ratio
72.43%
Dividend Growth​
3 months
Since 2026
Analyst Consensus >
―
Last 3 Months
Open HK:2291 in Dividend Calculator >

Dividend Amount Per Share​

Dividend Yield displayed is the dividend yield on the ex. date of the dividend
Daily Dividend Calendar >

2291 Dividend History

Ex-Date
Record Date
Payment Date
Frequency
Declaration Date
Amount
May 27, 2026
May 29, 2026
Jul 31, 2026
Annually―HK$0.57
May 26, 2025
――Annually―HK$0.67
May 28, 2024
――Annually―HK$0.63
The table shows LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H’s dividend history, including amount per share, payout frequency, declaration, record, and payment dates.

FAQ

Does LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H pay dividends?
Yes, HK:2291 has paid a dividend within the past 12 months.
    How much is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's dividend?
    HK:2291 pays a dividend of HK$0.573 per share. HK:2291's annual dividend yield is 4.22%.
      When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H ex-dividend date?
      LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's previous ex-dividend date was on May 27, 2026. LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H shareholders who own HK:2291 stock before this date received LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's last dividend payment of HK$0.57 per share on Jul 31, 2026. HK:2291's next ex-dividend date has not been announced yet.
        When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H dividend payment date?
        LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's next quarterly payment date is on Jul 31, 2026, when LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H shareholders who owned HK:2291 shares before May 27, 2026 received a dividend payment of HK$0.57 per share. Add HK:2291 to your watchlist to be reminded of HK:2291's next dividend payment.
          Does LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H have sufficient earnings to cover their dividend?
          Yes, HK:2291's past year earnings per share was HK$0.49, and their annual dividend per share is HK$0.57. HK:2291's dividend payout ratio is 72.43% (HK$0.57/HK$0.49) which is sustainable.