TSMC considering advanced chip packaging capacity in Japan, Reuters reports

TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan’s efforts to reboot its semiconductor industry, Reuters’ Sam Nussey, Fanny Potkin, and Miho Uranaka report. The deliberations are at an early stage, they added. One option the chipmaking giant is considering is bringing its chip on wafer on substrate packaging technology to Japan, according to one of the sources who was briefed on the matter.