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iPhone overheating issues unrelated to TSMC’s 3nm node, says Ming-Chi Kuo

Apple (AAPL) analyst Ming-Chi Kuo said in a Medium post that iPhone 15 temperature issues are likely due to thermal system design compromises to achieve a lighter weight, and are unrelated to TSMC’s (TSM) 3nm node. If Apple does not properly address this issue, it could negatively impact shipments over the product life cycle of the iPhone 15 Pro series, the analyst said.

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