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Chipbond Technology Corporation (6147) Dividend Date & History

Chipbond Technology Corporation (6147) pays a Annually dividend. This page shows 6147’s dividend history, latest dividend amount, dividend yield, ex-dividend date, record date, and dividend payment date.

Dividend Data

Last Ex-Dividend Date
Jun 17, 2026
Payment date
Jul 15, 2026
Dividend Amount Per Share
TWD 2.80
Annually
Dividend Yield
1.65%
Payout Ratio
51.41%
Dividend Growth
5 months
Since 2026

Dividend Amount Per Share

TWD 0.00TWD 2.00TWD 4.00TWD 6.00Jul 2015Jul 2016Jul 2017Jul 2018Jul 2019Jul 2020Jul 2021Jul 2022Jun 2023May 2024Jun 2025Jun 2026

6147 Dividend History

TW:6147 dividend history
Ex-DateRecord DatePayment DateFrequencyDeclaration DateAmount
Jun 17, 2026Jun 18, 2026Jul 15, 2026Annually―TWD 2.80
Jun 17, 2025Jun 18, 2025Jul 15, 2025Annually―TWD 3.75
May 23, 2024May 24, 2024Jun 14, 2024Annually―TWD 3.75
Jun 16, 2023Jun 19, 2023Jul 14, 2023Annually―TWD 5.50
Jul 20, 2022Jul 21, 2022Aug 12, 2022Annually―TWD 6.00
Jul 21, 2021Jul 22, 2021Aug 13, 2021Annually―TWD 3.80
Jul 23, 2020Jul 26, 2020Aug 14, 2020Annually―TWD 4.20
Jul 25, 2019Jul 26, 2019Aug 19, 2019Annually―TWD 3.50
Jul 25, 2018Jul 26, 2018Aug 17, 2018Annually―TWD 2.35
Jul 27, 2017Jul 29, 2017Aug 18, 2017Annually―TWD 2.10

The table shows Chipbond Technology Corporation’s dividend history, including amount per share, payout frequency, declaration, record and payment dates.

FAQ

Does Chipbond Technology Corporation pay dividends?
Yes, TW:6147 has paid a dividend within the past 12 months.
How much is Chipbond Technology Corporation's dividend?
TW:6147 pays a dividend of NT$2.8 per share. TW:6147's annual dividend yield is 1.65%.
When is Chipbond Technology Corporation ex-dividend date?
Chipbond Technology Corporation's previous ex-dividend date was on Jun 17, 2026. Chipbond Technology Corporation shareholders who own TW:6147 stock before this date received Chipbond Technology Corporation's last dividend payment of NT$2.8 per share on Jul 15, 2026. TW:6147's next ex-dividend date has not been announced yet.
When is Chipbond Technology Corporation dividend payment date?
Chipbond Technology Corporation's next quarterly payment date is on Jul 15, 2026, when Chipbond Technology Corporation shareholders who owned TW:6147 shares before Jun 17, 2026 received a dividend payment of NT$2.8 per share. Add TW:6147 to your watchlist to be reminded of TW:6147's next dividend payment.
Does Chipbond Technology Corporation have sufficient earnings to cover their dividend?
Yes — TW:6147's payout ratio is 51.41% (NT$2.80 ÷ NT$5.45 trailing-12-month EPS).