Chipbond Technology Corporation (6147) Stock Price & Analysis
6147 Stock Chart & Stats
- Day’s Range
- TWD 142.00 - TWD 148.00
- 52-Week Range
- TWD 50.20 - TWD 313.50
- Previous Close
- TWD 157.50
- Volume
- N/A
- Average Volume (3M)
- 25.36M
- Market Cap
- TWD 105.73B
- Enterprise Value
- TWD 152.86B
- Total Cash (Recent Filing)
- TWD 6.48B
- Total Debt (Recent Filing)
- TWD 1.65B
- Price to Earnings (P/E)
- 28.3
- Beta
- 1.78
- Next Earnings
- Feb 19, 2027 (Est.)
- EPS Estimate
- N/A
- Last Dividend Ex-Date
- Jun 17, 2026
- Dividend Yield
- 1.97%
6147 FAQ
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Company Description
Chipbond Technology Corporation
Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
- Sector
- General
- Industry
- Semiconductors
- CEO
- Huoo-Wen Gau
- Employees
- 5,630
- Website
- www.chipbond.com.tw
- Address
- No. 3, Lixing 5th Road, Hsinchu City, 300094, TW
Chipbond Technology Corporation (6147) Earnings & Revenues
Technical Analysis
Overall Consensus
| Indicator | Bullish | Neutral | Bearish |
|---|---|---|---|
| Overall Consensus | 6 | 2 | 14 |
| Technical Analysis | 6 | 2 | 2 |
| Moving Averages | 0 | 0 | 12 |
