Xintec Inc. (3374) Stock Price & Analysis
3374 Stock Chart & Stats
- Day’s Range
- TWD 362.50 - TWD 377.00
- 52-Week Range
- TWD 127.00 - TWD 530.00
- Previous Close
- TWD 402.50
- Volume
- N/A
- Average Volume (3M)
- 9.55M
- Market Cap
- TWD 101.76B
- Enterprise Value
- TWD 39.72B
- Total Cash (Recent Filing)
- TWD 6.12B
- Total Debt (Recent Filing)
- TWD 4.10B
- Price to Earnings (P/E)
- 62.4
- Beta
- 1.39
- Next Earnings
- Feb 15, 2027 (Est.)
- EPS Estimate
- N/A
- Last Dividend Ex-Date
- Jun 24, 2026
- Dividend Yield
- 0.67%
3374 FAQ
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When is Xintec Inc.’s upcoming earnings report date?
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Company Description
Xintec Inc.
Xintec Inc., founded in 1998 and based in Taoyuan City, Taiwan, is a leading specialist in sophisticated wafer-level chip scale packaging (WLCSP) solutions. The company maintains a global presence, serving markets across Asia, the United States, and Europe. Its extensive range of services includes WLCSP for crucial components such as image and environmental sensors. Xintec also provides wafer-level post-passivation interconnection (WLPI) specifically designed for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF devices. Additionally, they offer comprehensive wafer testing services. For optical sensors, Xintec delivers advanced chip scale packaging, incorporating features like side-wall interconnects and through-silicon via (TSV) redistribution layer products. These solutions accommodate diverse glass thicknesses and filters, and include glass bonding to wafers, available with or without a cavity. The company is also proficient in various wafer reconstruction methods, including front-side, backside, and stack wafer reconstruction, catering to mobile, automotive, and consumer electronics applications. They further specialize in wafer reconstruction with a glass lid, particularly for the automotive sector. Moreover, Xintec offers highly specialized packaging services for micro-electromechanical systems (MEMS) sensors. This encompasses wafer thinning, precise partial dicing of bonded wafers to expose bonding pads, and CSP utilizing via-last TSV for connecting pads from the wafer surface to the backside. They also employ dry etching of silicon to form large cavities, enhancing product performance. Supplementary offerings include 3D I/O redistribution, power and ground enhancement, and dual-side connection capabilities. Xintec's cutting-edge technologies are integral to a wide array of electronic products, such as tablets, notebooks, computers, and medical equipment.
- Sector
- General
- Industry
- Semiconductors
- CEO
- Chia Hsiang Chen
- Employees
- 1,498
- Website
- www.xintec.com.tw
- Address
- No. 23, Jilin Road, Taoyuan City, TP, 32062, TW
Xintec Inc. (3374) Earnings & Revenues
Technical Analysis
Overall Consensus
| Indicator | Bullish | Neutral | Bearish |
|---|---|---|---|
| Overall Consensus | 5 | 5 | 12 |
| Technical Analysis | 3 | 5 | 2 |
| Moving Averages | 2 | 0 | 10 |
