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Hong Leong Industries Bhd. (3301) Dividend Date & History

Hong Leong Industries Bhd. (3301) pays a Quarterly dividend. This page shows 3301’s dividend history, latest dividend amount, dividend yield, ex-dividend date, record date, and dividend payment date.

Dividend Data

Last Ex-Dividend Date
May 20, 2026
Payment date
Jun 10, 2026
Dividend Amount Per Share
MYR 0.20
Quarterly
Dividend Yield
5.95%
Payout Ratio
85.92%
Dividend Growth
6 months
Since 2026

Dividend Amount Per Share

MYR 0.00MYR 0.20MYR 0.40MYR 0.60Jun 2021Dec 2021Jun 2022Dec 2022Jun 2023Dec 2023Jun 2024Dec 2024Jun 2025Dec 2025Feb 2026May 2026

3301 Dividend History

MY:3301 dividend history
Ex-DateRecord DatePayment DateFrequencyDeclaration DateAmount
May 20, 2026May 21, 2026Jun 10, 2026Quarterly―MYR 0.20
Feb 27, 2026Mar 02, 2026Mar 17, 2026Quarterly―MYR 0.50
Dec 09, 2025Dec 10, 2025Dec 23, 2025SemiAnnually―MYR 0.30
Jun 11, 2025Jun 12, 2025Jun 25, 2025SemiAnnually―MYR 0.55
Dec 09, 2024Dec 10, 2024Dec 24, 2024SemiAnnually―MYR 0.25
Jun 04, 2024Jun 05, 2024Jun 25, 2024SemiAnnually―MYR 0.37
Mar 27, 2024Mar 29, 2024Apr 16, 2024NotAvailable―MYR 0.50
Dec 04, 2023Dec 05, 2023Dec 21, 2023SemiAnnually―MYR 0.20
Jun 01, 2023Jun 02, 2023Jun 20, 2023SemiAnnually―MYR 0.37
Dec 08, 2022Dec 09, 2022Dec 22, 2022SemiAnnually―MYR 0.20

The table shows Hong Leong Industries Bhd.’s dividend history, including amount per share, payout frequency, declaration, record and payment dates.

FAQ

Does Hong Leong Industries Bhd. pay dividends?
Yes, MY:3301 has paid a dividend within the past 12 months.
How much is Hong Leong Industries Bhd.'s dividend?
MY:3301 pays a dividend of RM0.2 per share. MY:3301's annual dividend yield is 5.95%.
When is Hong Leong Industries Bhd. ex-dividend date?
Hong Leong Industries Bhd.'s previous ex-dividend date was on May 20, 2026. Hong Leong Industries Bhd. shareholders who own MY:3301 stock before this date received Hong Leong Industries Bhd.'s last dividend payment of RM0.2 per share on Jun 10, 2026. MY:3301's next ex-dividend date has not been announced yet.
When is Hong Leong Industries Bhd. dividend payment date?
Hong Leong Industries Bhd.'s next quarterly payment date is on Jun 10, 2026, when Hong Leong Industries Bhd. shareholders who owned MY:3301 shares before May 20, 2026 received a dividend payment of RM0.2 per share. Add MY:3301 to your watchlist to be reminded of MY:3301's next dividend payment.
Does Hong Leong Industries Bhd. have sufficient earnings to cover their dividend?
MY:3301's dividend is covered by earnings, but the payout ratio is high at 85.92% (RM1.55 ÷ RM1.8 trailing-12-month EPS).