Record Consolidated Revenue and Strong YoY Growth
Consolidated revenue was a record $22.2 billion in Q2, up 48% year‑over‑year; Q3 consolidated revenue guidance of $29.4 billion implies +84% year‑over‑year growth.
Outstanding Profitability and Margins
Q2 operating margin was a record ~67% (67.3%), operating income was a record $14.9 billion (+52% YoY), and adjusted EBITDA was a record ~69% of revenue (~$15.2 billion), above guidance.
Explosive AI Semiconductor Growth
Q2 semiconductor revenue was a record $15.0 billion (+79% YoY). AI semiconductor revenue hit a record $10.8 billion, up 143% YoY and representing ~49% of total revenue; management expects Q3 AI semiconductor revenue of $16 billion (+200%+ YoY) and full‑year FY26 AI semiconductor revenue of ~$56 billion (~+180% YoY).
Large AI Bookings and Backlog Visibility
AI semiconductor bookings in the quarter exceeded $30 billion versus $10.8 billion shipped in the quarter, giving extended visibility out to 2028 and supporting large future shipments and platform initiatives.
Strategic Customer Agreements and Multi‑Gigawatt Commitments
Announced/confirmed multi‑year partnerships and commitments with major customers (Google long‑term TPU/networking agreement; Anthropic access to +1 GW in 2026 and additional 5 GW in 2027; OpenAI silicon delivered and contractual 1.3 GW deploy in 2027; Meta partnership with multiple generations and expected 3 GW through 2028). Management reiterated FY27 AI semiconductor revenue target in excess of $100 billion.
Software Business Durability and ARR Growth
Infrastructure software revenue was $7.2 billion in Q2 (+9% YoY), ARR grew ~17% YoY, and Q3 software revenue guidance of ~$8.9 billion implies +31% YoY. Software gross margin was ~93% and software operating margin ~79% (+310 bps YoY).
Record Free Cash Flow and Strong Cash Position
Q2 free cash flow was a record $10.3 billion (46% of revenue); cash balance rose to $19.6 billion from $14.2 billion the prior quarter. Capital expenditures were modest at $231 million. Returned $3.1 billion in dividends in the quarter.
Technology and Product Leadership for AI Infrastructure
Management emphasized leadership across XPUs, AI networking (Tomahawk 6 shipping; 200T switch tape‑out planned), co‑packaged optics, Jericho fabrics, and a broad component portfolio (SerDes, DSPs, lasers) to enable hyperscaler deployments and rack/cluster scale‑ups.