Tower Semiconductor and Fortsense, a leader in LiDAR SPAD technology solutions and ICs, announced the successful development of an advanced 3D imager for LiDAR application based on dToF technology. The newly developed product, FL6031, is based on Tower’s 65nm Stacked BSI CIS platform with pixel level hybrid bonding and is the first in a series of products designed to address the needs of numerous depth sensing applications in the automotive, consumer, and industrial markets among others. According to Yole Group, the 3D imaging, sensors, and systems market is expected to grow at 13% CAGR reaching a $17B by 2028.
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