Synopsys extends collaboration with TSMC

Synopsys (SNPS) announced it is extending its collaboration with TSMC (TSM) to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric technologies. The Synopsys Multi-Die System solution includes 3DIC Compiler, a unified exploration-to-signoff platform that delivers the highest levels of design efficiency for capacity and performance. In addition, Synopsys has achieved first-pass silicon success of its Universal Chiplet Interconnect Express IP on TSMC’s leading N3E process for seamless die-to-die connectivity.