MaxLinear, ColorChip team on optical, active electrical interconnect solutions

MaxLinear and ColorChip announced the availability of a complete line of optical and electrical interconnect solutions for data center applications based on MaxLinear’s 5nm Keystone family of DSPs. MaxLinear and ColorChip Announce Collaboration on a Complete Line of Optical and Active Electrical Interconnect Solutions By leveraging the high-performance, high-density, and industry leading power consumption of the Keystone 5nm IP, ColorChip believes it can offer customers a full line of 400G, 800G, and 1.6T solutions with best-in-class power consumption. "MaxLinear’s innovative Keystone 5nm DSP has enabled us to build the industry’s lowest power 13W 800G-DR8 optical modules, which will be on display at OFC 2023, and their KGD bare die solutions have enabled us to implement the highest density 1.6T OSFP-XD AECs on the market," said Xin Wu, EVP at ColorChip. "We are now leveraging these capabilities to enable a broad range of optical and electrical interconnect solutions for our customers with best-in-class power consumption and performance."