IBM signs agreements with government of Canada, Quebec valued at C$187M

IBM, the Government of Canada, and the Government of Quebec announced agreements that will strengthen Canada’s semiconductor industry, and further develop the assembly, testing and packaging capabilities for semiconductor modules to be used across a wide range of applications including telecommunications, high performance computing, automotive, aerospace & defense, computer networks, and generative AI, at IBM Canada’s plant in Bromont, Quebec. The agreements reflect a combined investment valued at approximately C$187M. In addition to the advancement of packaging capabilities, IBM will be conducting R&D to develop methods for scalable manufacturing and other advanced assembly processes to support the packaging of different chip technologies, to further Canada’s role in the North American semiconductor supply chain and expand and anchor Canada’s capabilities in advanced packaging.