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Honeywell and NXP Semiconductors sign MOU
The Fly

Honeywell and NXP Semiconductors sign MOU

Honeywell (HON) and NXP Semiconductors (NXPI) announced at CES 2024 that they have signed a Memorandum of Understanding, or MOU, to help optimize the way commercial buildings sense and securely control energy consumption. According to the International Energy Agency, or IEA, buildings’ operations contribute to 30% of global final energy consumption and 26% of global energy-related emissions, so decisions made today will significantly impact future energy use and potential savings. Today’s smart energy solutions increasingly leverage machine learning and data analytics to enhance buildings’ autonomy and energy efficiency. The collaboration aims to help make buildings operate more intelligently by integrating NXP Semiconductors’ neural network-enabled, industrial-grade applications processors into Honeywell’s building management systems. The MOU will initially focus on the Honeywell Optimizer Suite, which offers a flexible, more future-proofed building control and automation platform.

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