D-Wave Quantum announces initiative to advance quantum processor packaging

D-Wave Quantum (QBTS) announced a new strategic development initiative focused on advanced cryogenic packaging to advance and scale both gate model and annealing quantum processor development. The initiative will expand the company’s multichip packaging capabilities, equipment, and processes. As part of this, D-Wave is leveraging expertise and processes at the NASA Jet Propulsion Laboratory and has demonstrated end-to-end superconducting interconnect between chips.