At the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to address the patterning requirements of chips in the “angstrom era.” As chipmakers transition to process nodes at 2nm and below, they increasingly benefit from new materials engineering and metrology techniques that help overcome EUV and High-NA EUV patterning challenges, including line edge roughness, tip-to-tip spacing limitations, bridge defects and edge placement errors.
Published first on TheFly – the ultimate source for real-time, market-moving breaking financial news. Try Now>>
See the top stocks recommended by analysts >>
Read More on AMAT:
- Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era Chipmaking
- Applied Materials price target raised to $230 from $170 at Argus
- Applied Materials to Participate in the Morgan Stanley Technology, Media & Telecom Conference
- Early notable gainers among liquid option names on February 16th
- Applied Materials price target raised to $240 from $160 at Craig-Hallum