Taiwan Semiconductor Manufacturing (TSM) has released an update.
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Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) has demonstrated resilience in the face of a magnitude 7.2 earthquake, with over 70% of fab tool recovery within 10 hours and complete recovery by the third day, ensuring minimal impact on second-quarter revenue. Despite some initial wafer losses, which are expected to be mostly recovered within the quarter, TSMC maintains its full-year revenue growth guidance in the low-to-mid-twenties percentage. The earthquake’s total impact is projected to decrease the second quarter gross margin by around 0.5%, with estimated losses of NT$3 billion, after accounting for insurance claims.
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