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United Micro (UMCN) Q3 2026 Earnings Report

MX:UMCN Q3 2026 EPS Results

Actual EPS
MXN 3.81
Consensus EPS
MXN 3.95
Beat/Miss
Missed by -MXN 0.13
One Year Ago EPS
MXN 3.66

MX:UMCN Q3 2026 Revenue Results

Actual Revenue
MXN 43.57B
Expected Revenue
MXN 43.73B
Beat/Miss
Missed by -MXN 151.98M
YoY Revenue Growth
+17.37%

Earnings Announcement Details

Quarter
Q3 2026
Date
10/28/2026
Time
Before Open
Conference Call
Wednesday, October 28, 2026
MX:UMCN Upcoming Earnings

United Micro's next earnings date is estimated for January 26, 2027, based on past reporting schedules.

Q3 2026 Earnings Call Audio

MX:UMCN Q3 2026 Earnings Call
0:00 / 0:00

Q3 2026 Earnings Slide Deck

Q3 2026 Earnings Call Summary

Q3 2026
Earnings Call Date:Oct 28, 2026|% Change Since:0.00%|
Earnings Call Sentiment|Positive

The call was strongly positive, with record wafer shipments, higher utilization, substantial year-to-date profit growth, firm fourth-quarter guidance, improving 2027 pricing expectations, and significant momentum in AI-related technologies. The main challenges were capacity constraints, uneven demand in computers and some smartphone segments, and expected gross-margin pressure from higher depreciation and raw material costs. Overall, the positive operational and demand trends significantly outweighed the stated challenges.

Company Guidance

For the fourth quarter of 2026, UMC expects wafer shipments to increase by low single digits, ASP in U.S. dollar to remain firm, gross margin to be comparable to the preceding quarter, capacity utilization rate to be in the low 90% range, and the 2026 cash-based CapEx budget to be at $2 billion; specialty technology revenue will continue to grow sequentially, while the board approved an additional capital expenditure budget of approximately $3.2 billion. For 2027, UMC expects a 10% blended ASP increase year over year, with a meaningful positive uplift beginning in the first quarter, while capacity utilization remains at a very healthy level and shipment growth is constrained by available manufacturing capacity; silicon photonics will ramp in 2027 and advanced packaging in 2028. The current expansion roadmap targets monthly capacity approximately 18,000 wafers for silicon photonics, 22,000 for DTC and silicon capacitor, and 20,000 for TFLN modulators, with the next phase starting its ramp in late 2028 and reaching its final scale by 2030. AI-related revenue is close to $300 million in 2026 and is expected to exceed a quarter of revenue in the next three years, while depreciation is expected to show low single digit growth, at least for 2027, if not more for 2028; gross margins for the next two years at least will face pressure from depreciation and rising raw material costs, while UMC expects a healthy EBITDA margin structure.

  • Third-Quarter Revenue and Profit GrowthThird-quarter consolidated revenue was TWD 74.24 billion, up 8% sequentially, with gross margin improving from 32.5% to 34%. Net income attributable to shareholders was TWD 16.43 billion, and EPS was TWD 1.32.
  • Strong Year-to-Date Financial PerformanceFirst-nine-month revenue grew 16.1% year over year to TWD 204 billion, while gross profit increased 30.8% year over year to TWD 65.3 billion. Net income attributable to shareholders increased 136.5% year over year to TWD 74.86 billion, with year-to-date EPS of TWD 6, or $0.945 per ADS.
  • Record Wafer Shipments and Higher UtilizationHealthy demand across all market segments drove wafer shipments up 7.3% sequentially to more than 1.2 million 12-inch-equivalent wafers, a record high. Overall fab utilization reached 92%, up from 85% in the previous quarter, with several 12-inch fabs operating at full capacity and 8-inch operations recovering strongly.
  • Record 22/28nm PerformanceUMC's 22/28nm business had another record-breaking quarter, with 22nm revenue accounting for 18.3% of wafer sales. The combined 22nm and 28nm business represented approximately 35% of total revenue.
  • Stable Pricing and Revenue MixBlended ASP remained relatively stable and firm compared with the previous quarter. Revenue mix by geography, customer type, and application was described as virtually unchanged, with IDMs contributing approximately 14% of revenue, consumer applications around 32%, and fabless customers accounting for the remainder.
  • Solid Balance Sheet and Capacity ExpansionAt the end of the third quarter, total equity was TWD 470 billion and cash was approximately TWD 142 billion. Quarterly capacity continued to increase slightly, mainly from Fab 12i in Singapore, with total capacity expected to reach approximately 1.33 million 12-inch-equivalent wafers by the fourth quarter of 2026.
  • Positive Fourth-Quarter GuidanceFor the fourth quarter of 2026, UMC expects wafer shipments to increase by low single digits, U.S.-dollar ASP to remain firm, gross margin to be comparable to the preceding quarter, and capacity utilization to remain in the low 90% range. The 2026 cash-based CapEx budget is $2 billion.
  • Sustained Demand MomentumManagement expects positive demand momentum to continue into the fourth quarter and 2027, supported by healthy demand across core businesses, differentiated technologies, AI-related applications, customer share gains, and increased foundry share in selected markets.
  • Improving 2027 Pricing OutlookManagement expects 2027 to mark a turning point in the blended ASP trajectory, moving from historical ASP erosion toward a meaningful positive uplift beginning in the first quarter. UMC anticipates approximately a 10% blended ASP increase year over year for 2027, reflecting both pricing improvement and a richer product and technology mix.
  • AI-Related Growth OpportunitiesAI demand is contributing across power management, FPGAs, connectivity, silicon photonics, and advanced packaging. AI-related revenue is expected to be close to $300 million in 2026 and to exceed one-quarter of total revenue in the three years from the call.
  • Silicon Photonics and Advanced Packaging MomentumActive customer engagements in advanced packaging and silicon photonics remain robust, with some projects moving from qualification into production ramps and capacity planning. Management expects these businesses to contribute to sequential specialty-technology growth as existing projects ramp and new products complete tape-out and validation.
  • Customer Validation of Photonics PlatformsMultiple hyperscalers have qualified UMC's 1.6T optical transceiver platform. The 12-inch PIC platform supports 1.6T optical applications, while the 8-inch TFLN platform has completed 1.6T system validation with an industry-leading yield. UMC's roadmap extends toward 300G per lane and ultimately 400G per lane for next-generation 3.2T applications.
  • Progress in Advanced Packaging SolutionsUMC's discrete eDTC solution for mobile is entering mass production in the third quarter. Its substrate-embedded DTC solution for AI and server applications has completed tape-out and functional verification, while its customized memory-stacking solution has passed initial customer verification.
  • Additional Capacity Investment ApprovedThe board approved an additional capital expenditure budget of approximately $3.2 billion to accelerate expansion in response to customer product roadmaps and requirements. Planned monthly capacity includes approximately 18,000 wafers for silicon photonics, 22,000 for DTC and silicon capacitors, and 20,000 for TFLN modulators, with the next phase beginning to ramp in late 2028 and reaching final scale by 2030.
  • Customer-Backed and Phased Expansion StrategyManagement stated that the expansion is not broad-based and is directed toward customer-backed opportunities. Capacity additions will be phased and tied to customer commitments, product roadmaps, production ramps, and capacity requirements. Silicon photonics expansion is focused in Singapore, silicon capacitor capacity in Tainan, and TFLN in 8-inch operations.
  • New Businesses Expected to Be Margin AccretiveManagement stated that silicon photonics and advanced packaging are currently modeled to be above UMC's corporate-average margins, including when they ramp in 2027 and 2028. The company also expects its EBITDA margin structure to remain healthy.
  • Competitive Technology PositionManagement said UMC's PIC technology outperforms peers in key parameters such as propagation loss and has achieved high production yield. UMC also highlighted its 12-inch PIC platform, TFLN capability, hybrid bonding, chip-to-wafer integration, and advanced packaging expertise as differentiators.
  • Confidence in Demand Supporting ExpansionManagement said demand for silicon photonics and related AI infrastructure is growing faster than qualified capacity is being added, and that current customer demand and industry capacity plans support UMC's expansion. The company stated that customer demand is expected to exceed its planned capacity and that it does not believe it is building ahead of the market.
  • Healthy Automotive, Communication, and Industrial DemandBeyond AI, management reported robust communication, automotive, and industrial demand, including a healthy automotive industry recovery. UMC also sees opportunities from customer market-share gains and increased foundry share in premier smartphone, automotive, industrial, and specialty applications.

MX:UMCN Earnings History

MX:UMCN earnings history
Report DateFiscal QuarterForecast / EPSLast Year's EPSEPS YoY ChangePress Release
Jan 26, 20272026 (Q4)4.00-2.44――
Oct 28, 20262026 (Q3)3.953.813.664.10% (+0.15)
Jul 29, 20262026 (Q2)3.239.812.24338.66% (+7.57)
Apr 29, 20262026 (Q1)2.523.831.78114.74% (+2.05)
Jan 28, 20262025 (Q4)2.552.441.9525.00% (+0.49)
Oct 29, 20252025 (Q3)2.403.663.47.73% (+0.26)
Jul 30, 20252025 (Q2)2.612.243.17-29.59% (-0.94)
Apr 23, 20252025 (Q1)2.011.782.42-26.36% (-0.64)
Jan 21, 20252024 (Q4)2.691.953.17-38.46% (-1.22)
Oct 30, 20242024 (Q3)3.213.403.74-9.05% (-0.34)

The table shows recent earnings report dates and whether the forecast was beat or missed. See the change in forecast and EPS from the previous year.

Beat Missed
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