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Texas Instruments picks Lehi, Utah for next 300-mm semiconductor wafer fab
The Fly

Texas Instruments picks Lehi, Utah for next 300-mm semiconductor wafer fab

Texas Instruments announced plans to build its next 300-millimeter semiconductor wafer fabrication plant, or "fab," in Lehi, Utah. "The new fab will be located next to the company’s existing 300-mm semiconductor wafer fab in Lehi, LFAB. Once completed, TI’s two Lehi fabs will operate as a single fab," the company stated. Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer, said: "Our decision to build a second fab in Lehi underscores our commitment to Utah and is a testament to the talented team there who will lay the groundwork for another important chapter in TI’s future. With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the CHIPS and Science Act, there is no better time to further invest in our internal manufacturing capacity." The company added: "The landmark $11 billion investment marks the largest economic investment in Utah history. The Lehi expansion will create approximately 800 additional TI jobs as well as thousands of indirect jobs. TI looks forward to strengthening its partnership with the Alpine School District and will invest $9 million to improve student opportunities and outcomes."

Published first on TheFly

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