Texas Instruments announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions. TI developed a new device screening specification called space high-grade in plastic for radiation-hardened products and introduced new analog-to-digital converters that meet the SHP qualification. TI also introduced new product families to the radiation-tolerant Space Enhanced Plastic portfolio. Compared to traditional ceramic packages, plastic packages offer a smaller footprint that enables designers to reduce system-level size, weight and power, and thus help reduce launch costs.
Published first on TheFly
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