Synopsys (SNPS) announced its ongoing collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC’s processes and packaging technologies, driving innovation in AI chip and multi-die design. The 3DIC Compiler exploration-to-signoff platform and IP, tuned for 3D packaging, along with the company’s partnership with TSMC on design enablement has resulted in multiple customer tape-outs. Building on Synopsys’ continued collaboration with TSMC is the availability of certified digital and analog flows, along with the enabled Synopsys.ai on TSMC’s N2P and A16 processes using TSMC NanoFlex architecture. In addition, Synopsys provides automotive IP solutions for TSMC N5A and N3A processes and Interface and Foundation IP solutions.
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