Orbic North America, GCT Semiconductor announce partnership

Orbic North America and GCT Semiconductor (GCTS) announced the signing of a letter of intent for a partnership to jointly develop and supply an Orbic-branded mobile hotspot and FWA gateway utilizing a Verizon-certified 5G module based on GCT’s new 5G chipset. The LOI outlines the framework for collaboration between the parties, including terms related to volume purchases for supply to Verizon and other operators. As part of the collaborative multi-phase market rollout, Orbic and GCT will initially focus on devices for the Verizon network. Additionally, they will offer versions of the module and devices, including mobile hotspots and CPEs, to other network operators worldwide. GCT will support the joint development and technical efforts by providing core services, including technical expertise, and chipsets for volume production requirements. Orbic is building a manufacturing facility in Hauppauge, NY, which will be utilized for manufacturing CPEs, mobile hotspots, smartphones and tablets. The partnership contemplated by the LOI is subject to the negotiation of and entry into definitive agreements, and the parties intend to complete this process as soon as practicable.