Micron Technology is now sampling its multiplexed rank dual inline memory module. The MRDIMMs will enable Micron customers to run increasingly demanding workloads and obtain maximum value out of their compute infrastructure. For applications requiring more than 128GB of memory per DIMM slot, Micron MRDIMMs outperform current TSV RDIMMs by enabling the highest bandwidth, largest capacity with the lowest latency and improved performance per watt to accelerate memory-intensive virtualized multi-tenant, HPC and AI data center workloads The new memory offering is the first generation in the Micron MRDIMM family and will be compatible with Intel Xeon 6 processors.
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