Lightwave Logic announces issuance of U.S. patent for polymer modulators

Lightwave Logic announced the issuance of a U.S. patent, the application of which was announced in June 2022, on a new invention that will enable simplified foundry-level packaging of polymer modulators using chip scale techniques which can be applied at wafer level, critical for high-volume manufacturing applications. This patent issuance – entitled "Hybrid electro-optic polymer modulator with atomic layer deposition sealant layer" with patent number US 11,506,918 B2 – allows Lightwave Logic’s proprietary polymers to be sealed to moisture and atmospheric gases in a very low temperature and quasi-hermetic environment through the use of a chip-scale packaging approach that can be applied in parallel at wafer level and that eliminates the need for a separate hermetic enclosure or "gold box." Dr. Michael Lebby, Chief Executive Officer of Lightwave Logic, commented: "With the issuance of this exciting new patent and our recent acquisition of low temperature ALD processes, we continue to innovate our miniaturized packaging techniques using ALD to align with and surpass customer expectations. Both this patent as well as our recent low temperature ALD processes address the accelerating trend in photonics towards chip scale packaging, similar to what has been used in the silicon electronics industry. Further, the potential future impact of this invention on our foundry partners and associated back-end process development kits has the potential to be a critical feature of our next-generation polymer platform. The timing of this invention coincides well with our work with silicon foundries."