Reports Q4 revenue $181.3M, consensus $180.01M. CEO Fusen Chen stated, “We continue to drive market adoption of our advanced packaging and assembly solutions including vertical wire, high-power interconnect, advanced dispense and fluxless thermo-compression. Demand for these solutions is anticipated to accelerate along with coordinated General Semiconductor and Automotive market recovery through FY25.”
Elevate Your Investing Strategy:
- Take advantage of TipRanks Premium at 50% off! Unlock powerful investing tools, advanced data, and expert analyst insights to help you invest with confidence.
Published first on TheFly – the ultimate source for real-time, market-moving breaking financial news. Try Now>>
Read More on KLIC: