Jabil announced its continued investment in silicon photonics-based products and capabilities to support the increasing demands of hyperscalers and next-wave cloud and AI data center growth. The company is set to roll out additional capabilities at its Ottawa, Canada, site in the fourth calendar-year quarter of 2024 to support customers’ advanced photonics packaging new product introductions, or NPIs. The new product introduction, or NPI, line will feature innovative capabilities designed to assist photonics customers quickly scale from proof of concept to mass production, such as fluxless flip-chip, fiber attachment, precise die bonding, and wire bonding. These advancements will support silicon photonics chip packaging, particularly in high-speed connectivity applications such as co-packaged optics and high-speed on-board connections.
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