DuPont introduced the DuPont Pyralux ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux laminates for flexible and rigid-flex printed circuit boards. Developed for optimal thermal management, these laminates are an ideal solution for high-reliability markets such as aerospace, defense, electric vehicles, artificial intelligence related networking and other electronic devices. The Pyralux ML laminate series provides exceptional performance in challenging environments, making it a versatile and innovative solution for many different applications. DuPont is exhibiting the innovative new laminates this week during IPC APEX Expo, April 9-11, at the Anaheim Convention Center.
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