Camtek has recently received orders for 42 systems from several tier-1 semiconductor manufacturers. A significant portion of the orders are for the manufacture of chiplet modules and High Bandwidth Memory for heterogeneous integration. The systems are expected to be delivered during the second half of 2023. Chiplet module applications include artificial intelligence, data center processing and gaming. The integration of chiplets with several HBM modules results in processing units with superior performance.
Elevate Your Investing Strategy:
- Take advantage of TipRanks Premium at 55% off! Unlock powerful investing tools, advanced data, and expert analyst insights to help you invest with confidence.
Published first on TheFly – the ultimate source for real-time, market-moving breaking financial news. Try Now>>