Broadcom to showcase advancements at 2025 OCP Global Summit

Broadcom (AVGO) will showcase major advancements in its scale-up and scale-out AI networking solutions at the 2025 Open Compute Project Global Summit. Featuring innovations such as the Tomahawk 6, Tomahawk Ultra, Jericho4 Ethernet switches, and its third-generation TH6-Davisson Co-packaged Optics, Broadcom will present a comprehensive AI infrastructure portfolio designed to meet the exponential bandwidth demands of modern AI workloads while optimizing performance as models grow in scale and complexity. The 2025 OCP Global Summit will be held October 13 – 16 in San Jose. “Over the past year, Broadcom has played a pivotal role in enabling open, scalable and power-efficient AI infrastructure. Beyond introducing the Scale-Up Ethernet framework to the OCP community, we launched breakthrough products spanning low-latency ethernet, co-packaged optics and PCIe Gen 6,” said Charlie Kawwas, Ph. D., president of the Semiconductor Solutions Group, Broadcom. “We look forward to sharing our latest innovations and insights shaping the future of AI infrastructure at the OCP Global Summit next week.”