Broadcom to highlight solutions at 2024 Open Compute Project Global Summit

Broadcom announced that momentum continues to build in support of its vision of enabling AI infrastructure through a combination of open standards, scalability, and power efficient solutions. Broadcom will highlight advancements across the areas via a series of presentations, product demonstrations, and other forums at the 2024 Open Compute Project Global Summit. The 2024 Summit takes place in San Jose, Calif. from Oct. 15-17. At the summit several cutting-edge AI solutions will be featured including: Ethernet networking switches like the Tomahawk 5 and Jericho3-AI designed to accelerate AI/ML workloads. The Trident4-X11 Ethernet switch engineered to create the front-end fabric that interfaces with the back-end AI fabric. Tomahawk 5 – Bailly, the world’s leading 51.2 Tbps CPO Ethernet switch, which combines advanced silicon photonics CPO technology with Broadcom’s Tomahawk 5 switch chip, setting a new benchmark for power efficiency and performance in AI infrastructure. High-performance, low-power 400G PCIe Gen 5.0 Ethernet adapters, developed as open, standards-based solutions to address connectivity challenges as XPU bandwidth increases and AI data center clusters expand. PCIe Gen 5.0 switches, which are the open, standards-based fabric of choice for AI connectivity; drawing half the power of alternatives, with industry leading SerDes, telemetry and diagnostics. The industry’s first PCI Express Gen5/Gen6 retimers, offering ultra-low power solutions to enhance efficiency and scalability in AI infrastructure. Sian and Sian2 DSPs, supporting 200G/lane pluggable modules for connecting next-generation AI clusters.