Broadcom (AVGO) announced the expansion of its industry-leading 200G/lane DSP PHY portfolio with the introduction of Sian3 and Sian2M, purpose-built for the demanding connectivity requirements of AI/ML clusters. These innovations address the critical need for optimized power across both single-mode fiber and short-reach multi-mode fiber links in 800G and 1.6T optical transceiver applications. The rapid growth of AI workloads is driving demand for increased bandwidth and interconnect density in AI clusters. Optical interconnect power is a major factor limiting cluster scalability. Broadcom’s new Sian3 and Sian2M DSPs, along with its comprehensive portfolio of 200G/lane lasers, provide unprecedented levels of power efficiency and cost optimization for next-generation AI infrastructure.
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