Broadcom expands leadership on AI optical components

Broadcom announced several major accomplishments extending its market leadership with an expanded portfolio of optical interconnect solutions for artificial intelligence and machine learning applications. Broadcom’s optics technologies facilitate high speed interconnects for front-end and back-end networks of large-scale generative AI compute clusters. Key Announcement Highlights: production release of 200-Gbps per lane electro-absorption modulated laser to pair with next generation GPUs; Demonstration of the industry’s first 200G/lane vertical-cavity surface-emitting lasers; Demonstration of continuous wave laser with high efficiency and high linearity for silicon photonics modulation at 200G; Shipment of more than 20 million channels of 100G/lane high speed optical components used in AI/ML systems. VCSEL and EML technologies play a crucial role in enabling high-speed interconnects for AI and ML systems. Broadcom’s 200G VCSEL and EML products follow up on successful deployment of 100G/lane VCSEL and EML chips into first-generation generative AI networks and will provide unrivaled bandwidth and interconnect density for next generation interconnects. Both product families from Broadcom represent trusted and reliable technologies that will enable integration partners to use existing capacity as end users progress to 1.6T optical transceivers and usher in the era of terabit connectivity.