Broadcom announces AI infrastucture innovations

Cloud and data center providers are building AI systems at a pace that requires a new level of performance, scale and efficiency. Consumer AI use cases are increasingly driving the need for lowest power custom AI accelerators, while open, standards-based merchant networking solutions scale large AI clusters. Broadcom is evolving a broad portfolio of technologies to extend its leadership in enabling next-generation AI infrastructure. This includes foundational technologies and advanced packaging capabilities aimed at building the highest performance, lowest power custom AI accelerators. In addition, the complete set of end-to-end merchant silicon connectivity solutions ranging from best-in-class Ethernet and PCIe to optical interconnects with co-packaging capabilities drives the scale-up, scale-out and front-end networks of AI clusters. “For providers contending with the ever-increasing demand for generative AI clusters, the key to success will be a network-centric platform, based on open solutions, that scales at the lowest power,” said Charlie Kawwas, Ph. D., president of Broadcom’s Semiconductor Solutions Group. “The innovations we’ve introduced extend our leadership for custom AI accelerators, Ethernet, PCI Express and optical interconnect portfolios. Built on our world-class foundational technologies like SerDes and DSP, they provide the best custom XPUs and merchant networking solutions enabling AI infrastructure.”