Akoustis completes qualification of first wafer-level-packages for 5G mobile

Akoustis Technologies announced that it has completed qualification and released its internally developed proprietary wafer-level-packaging, WLP, technology for the 5G mobile, Wi-Fi, timing control, and other markets. In response to global supply chain challenges, Akoustis has been developing proprietary WLP technology in its New York fab facility for the past year while also rapidly expanding its manufacturing capacity to target the 5G mobile device, Wi-Fi, timing control, and other markets with its XBAW filter products and advanced packaging. The Company has used its first Tier-1 5G mobile customer to exercise the manufacturing process of its new WLP technology and as the qualification vehicle. The first WLP packages have been production released for the 5G mobile and timing control markets. Jeff Shealy, founder and CEO of Akoustis, stated, "I am pleased to report that the development of our wafer-level-package technology manufactured in our New York fab facility has been successfully completed." Shealy continued, "The qualification of this new, advanced WLP process and packages enables smaller form factors, lower cost and will open significant high-volume markets to Akoustis including 5G smartphones, tablets and computing, representing the largest revenue opportunities for our XBAW(R) technology." Akoustis continues to add new Wi-Fi design wins, many of which are expected to ramp into production in calendar year 2023.