Aeluma (ALMU) announced a contract with the U.S. Navy that could accelerate development of high-speed photodetectors for government and commercial applications. Aeluma’s large-diameter wafer platform combines the performance of compound semiconductors with the scale of mainstream silicon manufacturing, enabling cost-effective solutions across high-growth markets including mobile, AI, defense and aerospace, automotive, AR/VR, and quantum computing. Relevant to today’s announcement, Aeluma’s platform has demonstrated high-speed photodetectors for optical interconnects with the potential to provide massive bandwidth scaling, critical for government applications, high-performance computing, and AI infrastructure. The new contract is for up to $1.3M in funding, includes a major global interconnect manufacturer as a proposed subcontractor, and involves support from a top-tier government prime contractor. In addition to scaling for high-volume commercial markets, Aeluma’s large-diameter wafer platform is compatible with wafer-scale integration with complementary metal-oxide-semiconductor electronics using advanced packaging, a technology that is being aggressively pursued by major compute, data center, networking, and module suppliers for next-generation optical interconnects.
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