Asahi Diamond Industrial Co ( (JP:6140) ) has provided an announcement.
Asahi Diamond Industrial Co., Ltd. has established a joint venture with Tokyo Seimitsu Co., Ltd. to develop, manufacture, and sell hub blades, which are a type of dicing blade used primarily for cutting silicon wafers. This strategic partnership aims to enhance their ability to meet customer needs in the semiconductor industry by leveraging combined expertise and resources, although the financial impact on the company’s performance remains undetermined at this time.
More about Asahi Diamond Industrial Co
Asahi Diamond Industrial Co., Ltd. operates in the industrial manufacturing sector, focusing on the development and production of diamond tools. Their primary products include dicing blades, which are crucial components in dicing machines used for cutting silicon wafers, a process essential in semiconductor manufacturing.
Average Trading Volume: 180,441
Current Market Cap: Yen38.94B
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