Microchip Technology announces a new comprehensive hybrid power drive module, the first variant introduced in the new product line of power devices that will be available in 12 different variants with either silicon carbide MOSFETs or insulated-gate bipolar transistors. These hybrid power drive modules are highly integrated power semiconductor devices that reduce the number of components and simplify the overall system design. The configurable power devices include a three-bridge topology that are available in SiC or Si semiconductor technologies. Offering a compact design and low weight and profile, these high-reliability power devices help reduce the size and weight of MEAs.
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