Lantronix announced the expansion of its Open-Q family with its new entry-level Open-Q 2290CS and mid-tier Open-Q 4290CS System-in-Package chipset modules as well as the companion Open-Q AL2 Development Kit. The two SIP modules are footprint compatible, allowing for flexibility in hardware design choice. The SIP modules are based on the Qualcomm QCS2290 and QCS4290 System-on-Chip, utilizing Qualcomm Technologies’ heterogenous compute expertise with multiple specialized processing cores. The new Open-Q SIP modules deliver powerful performance, vivid graphics, dynamic camera capabilities and a broad set of connectivity options.
Published first on TheFly
See the top stocks recommended by analysts >>
Read More on LTRX:
- Lantronix to Report Fiscal 2023 Second Quarter Results on Feb. 9, 2023
- Lantronix Expands Open-Q Family With New SIP Modules That Deliver Powerful Performance, Vivid Graphics, Dynamic Camera Capabilities and Broad Connectivity Options
- Lantronix price target lowered to $11 from $13 at Canaccord
- Lantronix appoints Eric Bass as VP, engineering
- Lantronix sees FY23 revenue $f $135M -$145M, consensus $159.34M
