Infineon, Stellantis sign memorandum of understanding for silicon carbide chips

Infineon Technologies (FNNY) and Stellantis (STAL) have signed a non-binding memorandum of understanding as a first step towards a potential multi-year supply cooperation for silicon carbide semiconductors. Infineon would reserve manufacturing capacity and supply CoolSiC "bare die" chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. The potential sourcing volume and capacity reservation have a value of significantly more than EUR 1B, the companies said in a statement. "We firmly believe in electromobility and are excited to develop partnerships with leading automotive companies like Stellantis that make it a part of people’s everyday life," said Peter Schiefer, Division President Automotive of Infineon. "Compared to traditional power technologies, silicon carbide increases the range, efficiency and performance of electric vehicles. With our leading CoolSiC technology and continuous investments in our manufacturing capacities, we are well positioned to meet the growing demand for power electronics in electromobility."