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WuXi AppTec’s $500 Million Bond Issue Completion
Company Announcements

WuXi AppTec’s $500 Million Bond Issue Completion

WuXi AppTec Co., Ltd. Class H (HK:2359) has released an update.

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WuXi AppTec Co., Ltd. has successfully completed the issuance of $500 million zero coupon guaranteed convertible bonds due in 2025. The net proceeds of approximately $494.4 million will primarily support global expansion, with smaller portions allocated to refinancing debt and general corporate purposes. The bonds are set to be listed on the Hong Kong Stock Exchange, with trading expected to commence on October 22, 2024.

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